Mobile Phone

Laser Depaneling UV Laser Precision Laser Cutting,CWVC-5S

Product description: Laser Depaneling UV Laser Precision Laser Cutting,CWVC-5S
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Laser Depaneling UV Laser Precision Laser Cutting,CWVC-5S Advantages:
High precision CCD automatic positioning, automatic focusing. Fast and accurate
positioning, save time and no worries.
Friendly interface,Simple operation, easy to use, free application; Small size, Save more
space; rigorous security design;
Reduce energy consumption, Cost savings.
Cost‐effective, fast cutting speed, stable performance

Mobile Phone pcb depanelizer,CWVC‐5S

Laser Depaneling UV Laser Precision Laser Cutting,CWVC-5S Technical Parameters:
Main body of laser: 1480mm*1360mm*1412 mm
Weight: 1500Kg
Power: AC220 V
Laser: 355 nm
Laser: Optowave 10W（US）
Material: ≤1.2 mm
Precisio: ±20 μm
Platfor: ±2 μm
Platform: ±2 μm
Working area: 600*450 mm
Maximum: 3 KW
Vibrating: CTI（US）
Power: AC220 V
Diameter: 20±5 μm
Ambient: 20±2 ℃
Ambient: ＜60 %
The Machine: Marble

Laser Depaneling UV Laser Precision Laser Cutting,CWVC-5S Our Service:

# 1 day delivery
# 24 hours fast response
# Largest manufactory in South China
# 100% responsible for quality
# 15 years experience
# Free sharpening for blades within 3 months

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